Medium temperature BGA flux solder paste BST-506A
    Medium temperature BGA flux solder paste BST-506A

Medium temperature BGA flux solder paste BST-506A

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BEST solder paste BST-506A, with lead, medium temperature 183°, 50g

Highly efficient lead solder paste The best with a melting point of 183°C.

Features

Composition: Sn63/Pb37

Melting point: 183°C

NW: 50g

Packaging dimensions: 5 x 1.5 x 5cm

14144
10 Items

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