- New
Key Technical Specifications
Key Technical Specifications
Capacity: 16 GB
Interface: eMMC 5.1
Performance mode: HS400 (DDR up to 400 MB/s)
Package: FBGA-153 (153-ball)
Dimensions: 11.5 × 13.0 × 0.8 mm
Memory type: 2-bit MLC (Multi-Level Cell) NAND Flash
Operating voltage (VCC - Core): 2.7V – 3.6V
I/O Voltage (VCCQ): 1.70V – 1.95V (typical 1.8V)
Operating temperature: -25°C … +85°C
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