- Nou
Key Technical Specifications
Key Technical Specifications
Capacitate: 16 GB
Interfață: eMMC 5.1
Mod performanță: HS400 (DDR până la 400 MB/s)
Pachet: FBGA-153 (153-ball)
Dimensiuni: 11.5 × 13.0 × 0.8 mm
Tip memorie: 2-bit MLC (Multi-Level Cell) NAND Flash
Tensiune operare (VCC - Core): 2.7V – 3.6V
Tensiune I/O (VCCQ): 1.70V – 1.95V (tipic 1.8V)
Temperatură operare: -25°C … +85°C
This website uses cookies to ensure you get the best experience on our website